Features
■ Patent-Acquired Device for Separating Underfill-Loaded Boards and Components
A device that separates boards and components with underfill without causing damage.
■ Automatic Removal of Underfill-Loaded BGA
Automatically removes underfill-loaded BGA without scratching the components or boards.
■ Safe Removal Without Contacting Surrounding Components
Ensures safe removal without making contact with surrounding components.
■ Easy Operation with Temperature Profile and Start Button
Operates easily by calling up the temperature profile and pressing the start button.
■ Space-Saving and Suitable for Desktop Use
Compact design suitable for use on a desktop.
