CATALOG | SD-3500.pdf | 1.09MB |
MANUAL | - | - |
MOVIE FILE | SD-3500.wmv | 4.68MB |
Hot Air Reflow Heating Source
Prevents Dissolution of PCB Lands and using N2 Will Reduce Oxidation.
Eliminates the need for solder replacement,
only requires electricity and air.
Built-in Preheater
No Need for Separate Preheat which Significantly Reduces Board Stress.
Compact Front Control Panel
Smartly arranged front panel allows for quick start-up and use.
7 Segment LED Display
Equipped with a 7 segment display that shows temperature and a variety of other errors. Allows confirmation of the work.
External Thermo-couple Input
Solder melt temperature can be measured by connecting a K-type thermocouple to the solder area. Allows for a more controlled method of working instead of working by "feel."
Internal Memory and Security Functions
Up to 10 different profiles can be stored into memory and called up with a simple touch of a button. Unauthorized change of a profile can be prevented by using the security setting which prevents the user from changing the profile.
Power | 200-240 VAC, Single Phase |
Power Consumption | 3.4 Kilowatts |
Air Requirement | 35 kpa (functions between 30 - 40 kpa) |
Heaters | Main Heater-Hot Air: 1400W (4 X 350W) Area Heater-Infrared: 2000W (4 X 500W) |
Heat Control | Main Heater: 200 - 500 °C (in 5 °C steps) Area Heater: 300 - 500 °C (in 10 °C steps) |
Error Protection | External Air Supply Problem Main or Area Heater Overheat condition Internal Memory Check |