CATALOG | SD3000II_en.pdf | 3.18MB |
MANUAL | SD3000mark2-E-M.pdf | 100KB |
MOVIE FILE | - | - |
This rework system is designed to remove most SMT components like QFPs, SOPs, PLCCs SOJs, PGAs, BGAs, Connectors and other chips. It does not require any special nozzles or additional accessories. Built in timer to prevent overheating of board and component. The hot air nozzle has an adjustable motion range of up to 50mm per axis.
Control panel |
Rework Operation of QFPs and others The osollation range of Nozzle can be adjusted up to 50 mm in the axis of X and Y. The vacuum pick is used to quickly remove SMT components when the solder melting by hot blow air. |
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Rework Operation of Micro-components Set the X and Y Axis Knob at 0 and set the Blow Knob at 1 to 2. Confirming the target component with the optional camera and tool kits for small component or a magnified mirror, the removal can be done. |
Heating Method | HOT AIR NOZZLE -4mm dia, 350 Watts |
Airflow Rate | 1.5L - 12L/min in 8 Steps |
Air Pump and Vacuum Pump | Internal, Does not Require Shop Air |
Nozzle Motion Range Maximum | X & Y: 0-50mm, Z=25mm |
Temperature Control | Analog with Digital Readout for 260 to 600 °C |
Timer Control | Analog with Digital Readout for 5 - 500 seconds |
Max.PCB Size | Throat Depth=420mm, Width=Any Size |
Power Consumption | AC100V, 120V or 230V 360W 50/60Hz |
Dimensions | 300mmW x 310mmHx 450mm D |
Weight | 9kg |
Fujitsu, Fuji Electricals, Hitachi, Juki, JVC, Matsushita, Meidensha, Meteorlogical Agency Mitsubushi, NEC, National Observatory, Omuron, Oki Electricals, Panasonic, Sanyo, Sharp, Sony, Sumitomo, Toshiba, Yasukawa, Yokogawa and others